3M™ Scotch-Weld™ Epoxy Potting Compound DP270 is low viscosity for easy dispensing and potting. It is non-corrosive to copper, minimal exotherm and very low shrinkage – making it well-suited for potting and bonding electronic and electrical components.
For potting and bonding electronic and electrical components use 3M™ Scotch-Weld™ Epoxy Potting Compound DP270. Use our compound for joining, gluing, attaching, assembling, encapsulating, and sealing glass, plastic, rubber and steel. It has a long work time (70 minutes) for easy position and adjust and sets to handling strength in around three hours. It protects heat-sensitive components, preserving conductivity and insulation properties. And it’s non-corrosive to copper. Our rigid, two-part, epoxy adhesive potting compound is a 1:1 mix ratio, with a shear strength of 2450 To 2500 Psi.