1. Hong Kong
  2. All 3M Products
  3. Adhesives, Sealants & Fillers
  4. Structural Adhesives
  5. Two Part Structural Adhesives
  6. 3M™ Scotch-Weld™ Epoxy Potting Compound DP270 Clear, 50 mL, 12 per case

3M™ Scotch-Weld™ Epoxy Potting Compound DP270 Clear, 50 mL, 12 per case

  • 3M ID 62326214350
  • UPC 50021200822488

Features a 70 minute work life

Rigid potting compound is non-corrosive to copper

Minimal exotherm and very low shrinkage

View more details

Details

Highlights
  • Features a 70 minute work life
  • Rigid potting compound is non-corrosive to copper
  • Minimal exotherm and very low shrinkage
  • Flammability testing per UL94 HB

3M™ Scotch-Weld™ Epoxy Potting Compound DP270 is low viscosity for easy dispensing and potting. It is non-corrosive to copper, minimal exotherm and very low shrinkage – making it well-suited for potting and bonding electronic and electrical components.

For potting and bonding electronic and electrical components use 3M™ Scotch-Weld™ Epoxy Potting Compound DP270. Use our compound for joining, gluing, attaching, assembling, encapsulating, and sealing glass, plastic, rubber and steel. It has a long work time (70 minutes) for easy position and adjust and sets to handling strength in around three hours. It protects heat-sensitive components, preserving conductivity and insulation properties. And it’s non-corrosive to copper. Our rigid, two-part, epoxy adhesive potting compound is a 1:1 mix ratio, with a shear strength of 2450 To 2500 Psi.

Typical Properties